- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
Patent holdings for IPC class H01L 23/31
Total number of patents in this class: 19031
10-year publication summary
|
1503
|
1739
|
1857
|
1962
|
2054
|
2209
|
1903
|
1849
|
1851
|
732
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
3193 |
| Samsung Electronics Co., Ltd. | 131630 |
1305 |
| Intel Corporation | 45621 |
580 |
| Infineon Technologies AG | 8189 |
530 |
| Rohm Co., Ltd. | 5843 |
502 |
| Texas Instruments Incorporated | 19376 |
480 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
449 |
| Mitsubishi Electric Corporation | 43934 |
386 |
| STATS ChipPAC Pte. Lte. | 1516 |
351 |
| Micron Technology, Inc. | 24960 |
344 |
| Renesas Electronics Corporation | 6305 |
250 |
| Semiconductor Components Industries, L.L.C. | 5345 |
224 |
| Siliconware Precision Industries Co., Ltd. | 489 |
222 |
| Murata Manufacturing Co., Ltd. | 22355 |
214 |
| Amkor Technology Singapore Holding Pte. Ltd | 314 |
211 |
| NXP USA, Inc. | 4155 |
182 |
| Denso Corporation | 23338 |
170 |
| Fuji Electric Co., Ltd. | 4750 |
163 |
| Mediatek Inc. | 4584 |
160 |
| Qualcomm Incorporated | 76576 |
142 |
| Other owners | 8973 |